Sony MT27i 规格

一般信息
操作系统的详细信息
CPU信息
图形处理器细节
WiFi内核信息
build.prop
的内核模块
存储器映射

一般规格
生产厂家	Sony
型号	MT27i
Android版	4.0.4; ybt3zw; SDK15
中央处理单元	2 cores; ARMv7 Processor rev 1 (v7l) montblanc; Max: 1000,0 MHz; Min: 200,0 MHz
显示	854 x 480; DPI: 240; Evaluated Size: 4,1"
触摸屏	Multitouch 4 points
图形处理器	Mali-400 MP; ARM; OpenGL ES-CM 1.1; OpenGL ES 2.0
内存RAM	405 MB
快闪记忆体	8 GB Build-in (7.281 GB actual); 16 GB (14.980 GB actual)
沟通
电话	GSM; Net: EDGE
WiFi	cw1200_wlan; IEEE 802.11 a/b/g/n; ST-Ericsson CW1200; AP Mode
USB主机	Yes
蓝牙	Bluetooth 2.1
全球定位系统	Yes
高级功能
前置摄像头	Photo: 5.0 MP; Max: 2592x1944; Video: 0.9 MP; Max: 1280x720; Focus: auto infinity macro fixed continuous-picture continuous-video; Flash modes: off auto on red-eye torch
背照相机	No
传感器	ST accelerometer (ST Microelectronic); range: 0...16; resolution: 0,1 (0,625%); power: 0,1mA;
	Light sensor (Sony Mobile); range: 0...900; resolution: 1 (0,111%); power: 1mA;
	APDS9702 Proximity (Sony Ericsson); range: 0...1; resolution: 1 (100%); power: 20mA;
	ST magnetometer (ST Microelectronic); range: 0...8,2; resolution: 0,1 (1,22%); power: 1mA;
震动模式	Yes
支持的语言	49; Arabic; Bulgarian; Bengali; Catalan; Czech; Danish; German; Greek; English; Spanish; Estonian; Basque; Persian; Finnish; Filipino; French; Galician; Hebrew; Hindi; Croatian; Hungarian; Indonesian; Icelandic; Italian; Japanese; Kazakh; Korean; Lithuanian; Latvian; Macedonian; Malay; Norwegian; Dutch; Norwegian; Polish; Portuguese; Romanian; Russian; Slovak; Slovenian; Albanian; Serbian; Swedish; Thai; Tagalog; Turkish; Ukrainian; Vietnamese; Chinese
电池	Technology: Li-poly; Voltage: 3802
SD Version:	1.1 5

KERNEL: Linux version 3.0.8+ (BuildUser@BuildHost) (gcc version 4.4.3 (GCC) ) #1 SMP PREEMPT Mon Oct 15 14:57:07 2012
CODENAME: REL
Mainboard: montblanc
BRAND: SEMC
CPU_ABI: armeabi-v7a
CPU_ABI2: armeabi
DEVICE: MT27i
DISPLAY: 6.1.1.B.1.54
FINGERPRINT: SEMC/MT27i_1262-1440/MT27i:4.0.4/6.1.1.B.1.54/ybt3zw:user/release-keys
HARDWARE: st-ericsson
ID: 6.1.1.B.1.54
TAGS: release-keys

Processor : ARMv7 Processor rev 1 (v7l)
processor : 0
BogoMIPS : 4.80
processor : 1
BogoMIPS : 4.80
Features : swp half thumb fastmult vfp edsp neon vfpv3 tls
CPU implementer : 0x41
CPU architecture: 7
CPU variant : 0x2
CPU part : 0xc09
CPU revision : 1
Hardware : riogrande
Revision : 0000
Serial : 0000000000000000

GL_OES_texture_npot
GL_OES_compressed_ETC1_RGB8_texture
GL_OES_standard_derivatives
GL_OES_EGL_image
GL_OES_depth24
GL_ARM_rgba8
GL_ARM_mali_shader_binary
GL_OES_depth_texture
GL_OES_packed_depth_stencil
GL_EXT_texture_format_BGRA8888
GL_EXT_blend_minmax
GL_OES_EGL_image_external
GL_OES_EGL_sync
GL_OES_rgb8_rgba8
GL_EXT_multisampled_render_to_texture
GL_EXT_discard_framebuffer

<6>[70881.960601] cg2900-uart cg2900-uart.0: Set chip power: ENABLE
<6>[70882.329620] cg2900-uart cg2900-uart.0: Baud rate changed to 3250000 baud
<7>[70883.249786] WLAN device is ready.
<7>[70883.249847] Cut 2.x silicon is detected.
<7>[70883.250823] Cut 2.2 detected.
<7>[70883.250915] cw1200_load_firmware: CW1200 detected.
<7>[70883.398986] Firmware download completed.
<7>[70883.399047] SW IRQ subscribe
<6>[70883.401947] CW1200 WSM init done.
<6>[70883.401947] Input buffers: 8 x 1632 bytes
<6>[70883.401947] Hardware: 261.5
<6>[70883.401947] WSM firmware [WSM_A30.02.0395_PTA4W Jun 18 2012 10:13:51], ver: 3002, build: 395, api: 1044, cap: 0x000B
<7>[70883.526245] p2p_set_ps_modeinfo: 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 ................
<6>[70883.558349] ADDRCONF(NETDEV_UP): wlan0: link is not ready

##### Merging of the /util/data/semc_kernel_time_stamp.prop file #####
ro.build.date=Mon Oct 15 14:57:07 2012
ro.build.date.utc=1350305827
ro.build.user=BuildUser
ro.build.host=BuildHost
##### Final patch of properties #####
ro.build.product=MT27i
ro.build.description=MT27i-user 4.0.4 6.1.1.B.1.54 ybt3zw test-keys
ro.product.brand=SEMC
ro.product.name=MT27i_1262-1440
ro.product.device=MT27i
ro.build.tags=release-keys
ro.build.fingerprint=SEMC/MT27i_1262-1440/MT27i:4.0.4/6.1.1.B.1.54/ybt3zw:user/release-keys
######################## Customized property values #########################

ro.semc.version.cust=1262-1440
ro.semc.version.cust_revision=R2G
persist.sys.timezone=Europe/Moscow
#########################################################################

ro.config.ringtone=xperia.ogg
ro.config.notification_sound=notification.ogg
ro.config.alarm_alert=alarm.ogg
ro.semc.content.number=PA7
################# Updating of the SW Version #################
ro.semc.version.fs_revision=6.1.1.B.1.54
ro.build.id=6.1.1.B.1.54
ro.build.display.id=6.1.1.B.1.54
##### Values from product package metadata #####
ro.semc.product.model=MT27i
ro.semc.ms_type_id=AAD-3880134-BV
ro.semc.version.fs=WORLD
ro.semc.product.name=XPERIA sola
ro.semc.product.device=MT27
ro.product.model=MT27i
# begin build properties
# autogenerated by buildinfo.sh
ro.build.version.incremental=ybt3zw
ro.build.version.sdk=15
ro.build.version.codename=REL
ro.build.version.release=4.0.4
ro.build.type=user
ro.product.board=montblanc
ro.product.cpu.abi=armeabi-v7a
ro.product.cpu.abi2=armeabi
ro.product.manufacturer=Sony
ro.product.locale.language=en
ro.product.locale.region=GB
ro.wifi.channels=
ro.board.platform=montblanc
# ro.build.product is obsolete; use ro.product.device
# Do not try to parse ro.build.description or .fingerprint
ro.build.characteristics=nosdcard
# end build properties
#
# system.prop for pepper
#
rild.libpath=/system/lib/libu300-ril.so
rild.libargs=-c UNIX -n 2 -p /dev/socket/at_core -s /dev/socket/at_core -i rmnet
# The OpenGL ES API level that is natively supported by this device.
# This is a 16.16 fixed point number
ro.opengles.version=131072
# debug.sf.hw=0 Use b2r2 as compositor in SurfaceFlinger
# debug.sf.hw=1 Use Mali as compositor in SurfaceFlinger
debug.sf.hw=1
# Android defaults EGL preserved swap behaviour
# This gives bad performace for deferred renderers
# such as Mali.
hwui.render_dirty_regions=false
# system props for Battery test in Service menu
ro.semc.batt.capacity=1500
ro.semc.batt.test.z_threshold=50
ro.semc.batt.test.min_level=70
# System props for SOLS
ro.semc.sols.product-code=106
ro.semc.sols.company-code=5
# STE: Low power audio - enable ULP mode
ste.nmf.autoidle=1
# STE: Address of DBus STE bus
ste.dbus.bus.address=unix:path=/dev/socket/dbus_ste
# STE: UNSOL_CALL_RING is only sent once from RIL.
# Android needs to generate more rings if needed.
ro.telephony.call_ring.multiple=false
# prop to indicate what kind of external memory the product have.
ro.semc.product.user_storage=emmc_sdcard
ro.build.characteristics=default
# NFC
ro.nfc.on.default=false
ro.nfc.se.sim.enable=true
ro.nfc.se.smx.enable=false
ro.nfc.icon.enable=true
ro.nfc.vendor.name=nxp
#Default values/Locales for the hiding languages feature
ro.product.locale.excluded=ar_EG ar_IL fa_IR iw_IL
#Limitation on how much hwmem MM codecs should use
ste.video.decoder.max.hwmem=0x2600000
ste.video.decoder.max.res=720p
ste.video.decoder.h264.max.lev=3.2
#STE: Hardware video codecs configuration
ste.video.dec.mpeg4.in.size=8192
ste.video.enc.out.buffercnt=5
ste.video.dec.recycle.delay=1
#STE: Fast Dormancy Flag
# Fast Dormancy based on USB Tether Events and Screen States
ste.special_fast_dormancy=false
# System props for audio
persist.audio.hp=true
#
# ADDITIONAL_BUILD_PROPERTIES
#
ro.product-res-path=framework/SemcGenericUxpRes.apk
ro.setupwizard.mode=DISABLED
ro.com.google.gmsversion=4.0_r5
ro.com.google.clientidbase=android-sonyericsson
keyguard.no_require_sim=true
ro.com.android.dateformat=MM-dd-yyyy
ro.com.android.dataroaming=false
ro.semc.xloud.supported=true
dalvik.vm.heapstartsize=5m
dalvik.vm.heapgrowthlimit=48m
dalvik.vm.heapsize=128m
ro.sf.lcd_density=240
ro.am.max_recent_tasks=8
ro.usb.pid_suffix=173
dalvik.vm.dexopt-flags=m=y
net.bt.name=Android
dalvik.vm.stack-trace-file=/data/anr/traces.txt
ro.service.swiqi.supported=true
persist.service.swiqi.enable=1
ro.drm.active.num=3
ro.drm.active.0=marlin,1
ro.drm.active.1=hdcp_av8100,1
ro.drm.active.2=playready,0

cw1200_wlan 4253 0 - Live 0xbf027000
cw1200_core 121467 1 cw1200_wlan, Live 0xbf000000

RAM: 405 MB

System RAM: 96.000MB
db8500-trace-area: 15.000MB
System RAM: 32.000MB
System RAM: 277.000MB

Flash: 8 GB Build-in (7.281 GB actual); 16 GB (14.980 GB actual)

zram0: 0.059 GB
mmcblk0: 7.281 GB
mmcblk1: 14.921 GB

触摸屏为 Sony MT27i

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